Technology
Location：Index > Technology
| Number | Parameter | Technical specification | Remarks | |||
| 1 | Layers | 1-16 | ||||
| 2 | Material | FR-4 CEM-3 CEM-1 FR-1 | Special materials according to customer requirements | |||
| 3 | Finished board thickness | 0.4-6.0MM(15-236mil) | ||||
| 4 | Min-core thickness | 0.2MM(8mil) | ||||
| 5 | Resistance welding bridge | 0.076MM(3mil) | ||||
| 6 | Copper thickness | HOZ 1OZ 2OZ 3OZ | ||||
| 7 | Min.trace width&line space | double layer | 0.1MM(4mil) | |||
| 8 | Multi layer | 0.1MM(4mil) | ||||
| 9 | Min-hole diameter | Drilling/PTH | ∮0.15MM(6mil) | |||
| 10 | Punching | ∮0.7MM(28mil) | ||||
| 11 | Dimension tolerance | Hole position | ±0.05MM(±2mil) | |||
| 12 | （W）Width | ±20% | Special case±10% | |||
| 13 | （H）Hole diameter | PTH±0.076MM(±3mil) | ||||
| 14 | （H）Hole diameter | NPTH±0.05MM(±2mil) | ||||
| 15 | Outline dimension | 0.1MM(4mil) | ||||
| 16 | Conductors&Outline | 0.20MM(8mil) | ||||
| 17 | Warp and Twist | 0.75% | ||||
| 18 | Surface treatment |
HAL&Lead Free HAL AU/NI Immersion gold/Immersion sliver/Immersion Tin OSP |
OSP （+Immersion gold，+gold finger，no peel） | |||
| 19 | ET | Number of tests （MAX） | ET machine:12288 point； | |||
| Insulation resistance testing（MAX） | 50MΩ | |||||
| Conduction resistance test（MIN） | ET machine：20Ω | |||||
| Testing the size of PAD（MIN） | 0.25MM(10mil) | |||||
| Welding test plate of center distance（MIN） | 0.2MM(8mil) | |||||
| Testing Voltage（MAX） | 500V | |||||
| High Voltage test voltage（MAX） | 5000V | |||||
| High voltage test leakage voltage（MIN） | 10uA | |||||
| Testing the size of PCB | 450*965MM | |||||
| Testing the thickness of plating | 0.4-6.0MM(15-236mil) | |||||
